Presentation + Paper
28 February 2020 A bi-axial vacuum-packaged piezoelectric MEMS mirror for smart headlights
F. Senger, J. Albers, U. Hofmann, G. Piechotta, T. Giese, F. Heinrich, T. von Wantoch, S. Gu-Stoppel
Author Affiliations +
Proceedings Volume 11293, MOEMS and Miniaturized Systems XIX; 1129305 (2020) https://doi.org/10.1117/12.2542802
Event: SPIE OPTO, 2020, San Francisco, California, United States
Abstract
This paper presents a 2D MEMS mirror for smart headlights, combing high-Q vacuum package with AR (Anti Reflecting)-coating, piezoelectric driving and Lissajous scanning. While the vacuum package protects the MEMS device and the AR-coating suppresses parasite reflections from the glass lid, the AlN-based piezoelectric actuators are robust against shock and vibration in harsh environment, comparing to fragile capacitive finger structures. This gimbal-less MEMS mirror with a large circular aperture (diameter = 5.5 mm) utilizes Lissajous scanning possessing two perpendicular torsion modes with frequencies of fx = 2.26 kHz, fy = 2.30 kHz fulfilling high light density and large total optical scanning angles of 55°, 30° at ± 40 VAC. A 2D projection of 50° x 20° was realized, where the angle loss comparing to the 1D testing arose from pincushion distortion, whose effect was severely reduced by the redesign run. Due to the great long-term stability of AlN and protection of vacuum packages, the MEMS mirror also shows a good reliability. This paper will describe and discuss the design, fabrication and characterization results of this MEMS mirror.
Conference Presentation
© (2020) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
F. Senger, J. Albers, U. Hofmann, G. Piechotta, T. Giese, F. Heinrich, T. von Wantoch, and S. Gu-Stoppel "A bi-axial vacuum-packaged piezoelectric MEMS mirror for smart headlights", Proc. SPIE 11293, MOEMS and Miniaturized Systems XIX, 1129305 (28 February 2020); https://doi.org/10.1117/12.2542802
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CITATIONS
Cited by 2 scholarly publications and 1 patent.
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KEYWORDS
Microelectromechanical systems

Mirrors

Semiconducting wafers

Wafer bonding

Actuators

Aluminum nitride

Headlamps

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